Bergquist Hi Flow Thf 500 Hi-Flow 625

Features and Benefits  

1.Thermal impedance: 0.71°C-in2 /W (25 psi)   

2.Electrically isolating   

3.65°C phase change compound coated on PEN film   

4.Tack-free and scratch-resistant

BERGQUIST Hi-Flow 625 is a film-reinforced phase change material.

The product consists of a thermally conductive 65°C phase change compound coated on PEN film.  BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.

The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems.

The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature and  does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.

BERGQUIST HF625 Typical Applications Include:  1.Spring clip mounted  2. Power semiconductors  3.Power modules 

HI FLOW THF 500 Configurations Available:  1.Sheet form, die-cut parts and roll form  2. With or without pressure sensitive adhesive