Bergquist Hi-flow 565ut

BERGQUIST HI-FLOW THF 3000UT  Features and Benefits• Thermal impedance: 0.05°C-in.2/W(at 25 psi)• High thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky• Tabulated for ease of assembly

BERGQUIST HI-FLOW THF 3000UT is  a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the material undergoes a phase change softening, starting near 52°C. The phase change softening featureimproves handling characteristics prior to a facilitated assembly. At application temperatures andpressures, BERGQUIST   HI-FLOW 565UT wets out the thermal interfaces producing a very low  thermal impedance.BERGQUIST   HI-FLOW 565UT  Typical Applications Include:• Processor lid to heat sink• Processor die to lid or heat sink• FBDIMM to heat spreaderConfigurations Available:• Tabulated in roll form, kiss-cut parts – no holes• BERGQUIST HF565UT is limited to a square or rectangular part design.Dimensional tolerance is +/- 0.020 in. (0.5 mm)